6 Key Steps in the Semiconductor Manufacturing Process

Semiconductors play a vital role in modern electronics. They foster innovation in various sectors, such as telecommunications, healthcare, computing, and transportation.

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In 2022, the microelectronics sector reached an all-time high, producing 1.15 trillion semiconductor units to satisfy the soaring global demand. With the advent of disruptive technologies, the semiconductor industry is poised for rapid growth in the coming years.

To facilitate a better understanding, we have compiled this guide outlining the six essential stages in semiconductor production.

Understanding Semiconductor Manufacturing

The transformation of silicon and other raw materials into semiconductor devices constitutes a complex procedure that may extend over several months. Semiconductor manufacturing involves the fabrication of integrated circuits (IC), which includes transistors and additional components integral to contemporary electronic devices. A series of chemical and photographic processes convert a semiconducting material wafer into functional electronic circuits. Typically, pure elements like silicon or germanium serve as the semiconducting materials.

Requirements for Semiconductor Manufacturing

The fabrication journey encompasses three primary phases: wafer creation, circuit construction, and packaging. Below are the indispensable components involved in the process.

Raw Materials such as silicon or related compounds

Gases like nitrogen, oxygen, and argon, which establish the right environment and facilitate chemical reactions to adjust the electrical traits of the semiconductor

Semiconductor Manufacturing Equipment including dicing machines, probing machines, edge shaping apparatus, and grinders

Quality Control Systems like optical inspection technologies designed to maintain product quality

Steps in Semiconductor Manufacturing

Outlined below are the six fundamental steps in the semiconductor manufacturing process:

1. Wafer Fabrication

Silicon wafers form the substrate for semiconductor devices. The process initiates when a pure silicon crystal, known as an 'ingot,' is sliced into thin wafers and polished to perfection. This polishing step is crucial as it removes contaminants and imperfections, offering a solid base for chip fabrication. Even minor contamination can result in significant product defects. After polishing, a layer of conducting or semiconducting materials is deposited onto the wafer – a process called 'deposition.'

2. Photoresist Coating

Once the wafer is prepared, its surface is coated with a photoresist, a light-sensitive material that alters the wafer's chemical properties for circuit printing. There are two principal types of photoresists based on their reaction to ultraviolet light (UV): positive and negative.

Positive photoresist becomes soluble when exposed to UV light, dissolving and leaving behind the unexposed sections. In contrast, negative photoresists harden upon UV exposure. Due to their superior thermal stability and resolution, positive photoresists are more prevalent in semiconductor manufacturing.

3. Lithography

After applying the photoresist, the wafer is ready for the circuit design process known as photolithography. This involves placing the wafer in photolithography equipment where it is exposed to UV light. Light travels through a mask containing the circuit's blueprint, transferring the design onto the photoresist-coated wafer. Rigorous quality control is essential, as refraction and defects may occur during lithography.

4. Etching

Following the patterning, etching removes any residual materials from the wafer's surface. This can be performed in two principal ways:

1. Wet Etching involving chemical solutions
2. Dry Etching utilizing gases or plasma

Due to the multi-layered nature of semiconductor chips, photolithography and etching must be repeated for each layer, requiring utmost precision and process control to safeguard chip integrity.

5. Ion Implantation

Ion implantation introduces impurities such as arsenic or phosphorous ions into silicon wafers, enhancing their semiconducting properties. This is followed by heat processing that activates the ions, forming micro-transistors. The photoresist material acts as a barrier, preventing ions from entering locations prone to defects, and is removed afterward through ashing or chemical means.

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6. Assembly & Packaging

The semiconductor manufacturing process can span up to 26 weeks, from initial design to final production. The concluding phase involves slicing the wafer into individual chips (dicing) and affixing the chips onto a substrate through bonding. A protective metal casing with a cooling system is added to ensure the chip remains at optimal temperatures. The chip is now ready for its intended use.